JPH044743B2 - - Google Patents

Info

Publication number
JPH044743B2
JPH044743B2 JP60211438A JP21143885A JPH044743B2 JP H044743 B2 JPH044743 B2 JP H044743B2 JP 60211438 A JP60211438 A JP 60211438A JP 21143885 A JP21143885 A JP 21143885A JP H044743 B2 JPH044743 B2 JP H044743B2
Authority
JP
Japan
Prior art keywords
wafer
wafers
elastic body
peripheral edge
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60211438A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6271215A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP21143885A priority Critical patent/JPS6271215A/ja
Publication of JPS6271215A publication Critical patent/JPS6271215A/ja
Publication of JPH044743B2 publication Critical patent/JPH044743B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Recrystallisation Techniques (AREA)
JP21143885A 1985-09-25 1985-09-25 ウエハ接合装置 Granted JPS6271215A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21143885A JPS6271215A (ja) 1985-09-25 1985-09-25 ウエハ接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21143885A JPS6271215A (ja) 1985-09-25 1985-09-25 ウエハ接合装置

Publications (2)

Publication Number Publication Date
JPS6271215A JPS6271215A (ja) 1987-04-01
JPH044743B2 true JPH044743B2 (en]) 1992-01-29

Family

ID=16605954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21143885A Granted JPS6271215A (ja) 1985-09-25 1985-09-25 ウエハ接合装置

Country Status (1)

Country Link
JP (1) JPS6271215A (en])

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2589994B2 (ja) * 1987-12-24 1997-03-12 富士通株式会社 ウェーハの接着方法
US5273553A (en) * 1989-08-28 1993-12-28 Kabushiki Kaisha Toshiba Apparatus for bonding semiconductor substrates
USRE36890E (en) * 1990-07-31 2000-10-03 Motorola, Inc. Gradient chuck method for wafer bonding employing a convex pressure
US5131968A (en) * 1990-07-31 1992-07-21 Motorola, Inc. Gradient chuck method for wafer bonding employing a convex pressure
KR100289348B1 (ko) * 1992-05-25 2001-12-28 이데이 노부유끼 절연기판실리콘반도체장치와그제조방법
US5314107A (en) * 1992-12-31 1994-05-24 Motorola, Inc. Automated method for joining wafers
US5300175A (en) * 1993-01-04 1994-04-05 Motorola, Inc. Method for mounting a wafer to a submount
JPH10275852A (ja) * 1997-03-31 1998-10-13 Shin Etsu Handotai Co Ltd 半導体基板の接着方法および接着装置
US7866364B2 (en) 2006-04-28 2011-01-11 Hewlett-Packard Development Company, L.P. Fabrication tool for bonding
JP4786693B2 (ja) 2008-09-30 2011-10-05 三菱重工業株式会社 ウェハ接合装置およびウェハ接合方法
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
US11419231B1 (en) 2016-09-22 2022-08-16 Apple Inc. Forming glass covers for electronic devices
US11535551B2 (en) 2016-09-23 2022-12-27 Apple Inc. Thermoformed cover glass for an electronic device
US10800141B2 (en) 2016-09-23 2020-10-13 Apple Inc. Electronic device having a glass component with crack hindering internal stress regions
US11565506B2 (en) 2016-09-23 2023-01-31 Apple Inc. Thermoformed cover glass for an electronic device
US11066322B2 (en) 2017-12-01 2021-07-20 Apple Inc. Selectively heat-treated glass-ceramic for an electronic device
US11420900B2 (en) 2018-09-26 2022-08-23 Apple Inc. Localized control of bulk material properties
US11680010B2 (en) 2019-07-09 2023-06-20 Apple Inc. Evaluation of transparent components for electronic devices
US11460892B2 (en) 2020-03-28 2022-10-04 Apple Inc. Glass cover member for an electronic device enclosure
CN113453458B (zh) 2020-03-28 2023-01-31 苹果公司 用于电子设备壳体的玻璃覆盖构件
US11666273B2 (en) 2020-05-20 2023-06-06 Apple Inc. Electronic device enclosure including a glass ceramic region
WO2022133133A1 (en) 2020-12-17 2022-06-23 Apple Inc. Forming of glass components for portable electronic devices
US12065372B2 (en) 2020-12-17 2024-08-20 Apple Inc. Fluid forming a glass component for a portable electronic device
CN116783152A (zh) 2020-12-23 2023-09-19 苹果公司 用于电子设备的透明部件的基于激光的切割

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58116734A (ja) * 1981-12-29 1983-07-12 Canon Inc 露光装置
JPS61145839A (ja) * 1984-12-20 1986-07-03 Toshiba Corp 半導体ウエ−ハの接着方法および接着治具

Also Published As

Publication number Publication date
JPS6271215A (ja) 1987-04-01

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